TY - GEN
T1 - The viability of 25 Gb/s on-board signalling
AU - Ritter, Mark B.
AU - Pepeljugoski, Petar
AU - Gu, Xiaoxiong
AU - Kwark, Young
AU - Kam, Dong
AU - Rimolo-Donadio, Renato
AU - Wu, Boping
AU - Baks, Christian
AU - John, Richard
AU - Shan, Lei
AU - Schuster, Christian
PY - 2008
Y1 - 2008
N2 - What package improvements are required for dense, high aggregate bandwidth buses running at data rates beyond 10 Gb/s per pin, and when might optical interconnects on the board be required? We present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering these questions. Detailed electrical link models have been validated with active, high-speed differential bus measurements utilizing a 16-channel link chip with programmable equalization and a per-channel data rate of up to 11 Gb/s. Electrical signalling limits were then determined by extrapolating our models to higher speeds, and these limits were compared to the results of work on on-board optical interconnects.
AB - What package improvements are required for dense, high aggregate bandwidth buses running at data rates beyond 10 Gb/s per pin, and when might optical interconnects on the board be required? We present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering these questions. Detailed electrical link models have been validated with active, high-speed differential bus measurements utilizing a 16-channel link chip with programmable equalization and a per-channel data rate of up to 11 Gb/s. Electrical signalling limits were then determined by extrapolating our models to higher speeds, and these limits were compared to the results of work on on-board optical interconnects.
UR - http://www.scopus.com/inward/record.url?scp=51349147141&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2008.4550116
DO - 10.1109/ECTC.2008.4550116
M3 - Contribución a la conferencia
AN - SCOPUS:51349147141
SN - 9781424422302
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1121
EP - 1127
BT - 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
T2 - 2008 58th Electronic Components and Technology Conference, ECTC
Y2 - 27 May 2008 through 30 May 2008
ER -