TY - GEN
T1 - Signal integrity
T2 - Efficient, physicsbased via modeling: Principles and methods
AU - Rimolo-Donadio, Renato
AU - Müller, Sebastian
AU - Duan, Xiaomin
AU - Kotzev, Miroslav
AU - Brüns, Heinz D.
AU - Schuster, Christian
N1 - Publisher Copyright:
© 2012 IEEE Electromagnetic Compatibility.
PY - 2012/3/1
Y1 - 2012/3/1
N2 - This article discusses the high-frequency behavior of thru-hole vias enclosed by solid reference planes in packages and printed circuit boards and reviews some efficient modeling alternatives for signal and power integrity applications. The electromagnetic behavior of vias, including the excitation of parallel-plate modes and the role of return vias, is introduced as preamble to the modeling approaches. The physics-based via model and its building blocks are then discussed. The last section reviews some improvements to the via model, covering intrinsic models for the near field of vias and the utilization of contour integral and multiple scattering methods.
AB - This article discusses the high-frequency behavior of thru-hole vias enclosed by solid reference planes in packages and printed circuit boards and reviews some efficient modeling alternatives for signal and power integrity applications. The electromagnetic behavior of vias, including the excitation of parallel-plate modes and the role of return vias, is introduced as preamble to the modeling approaches. The physics-based via model and its building blocks are then discussed. The last section reviews some improvements to the via model, covering intrinsic models for the near field of vias and the utilization of contour integral and multiple scattering methods.
KW - Parallel plates
KW - Physics-based
KW - Power distribution network
KW - Printed circuit board
KW - Signal and power integrity
KW - Vias
UR - http://www.scopus.com/inward/record.url?scp=84887445249&partnerID=8YFLogxK
U2 - 10.1109/MEMC.2012.6244946
DO - 10.1109/MEMC.2012.6244946
M3 - Artículo
AN - SCOPUS:84887445249
SN - 2162-2264
VL - 1
SP - 55
EP - 61
JO - IEEE Electromagnetic Compatibility Magazine
JF - IEEE Electromagnetic Compatibility Magazine
ER -