Preparing 25Gbps electrical I/O for exascale computing systems

Lei Shan; Young Kwark; Renato Rimolo-Donadio; Christian Baks; Michael Gaynes; Timothy Chainer

doi:10.1109/ECTC.2014.6897570

Preparing 25Gbps electrical I/O for exascale computing systems

Lei Shan, Young Kwark, Renato Rimolo-Donadio, Christian Baks, Michael Gaynes, Timothy Chainer

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

Resumen

This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits as low as 1pJ/bit at 10Gbps for aggregated parallel links. Results from test vehicles confirmed over 20% reduction in channel loss at 20GHz when compared to currently leading commercial materials, which will permit the extension of electrical link performance to meet future system requirements.

Idioma original	Inglés
Título de la publicación alojada	Proceedings - Electronic Components and Technology Conference
Editorial	Institute of Electrical and Electronics Engineers Inc.
Páginas	1955-1958
Número de páginas	4
ISBN (versión digital)	9781479924073
DOI	https://doi.org/10.1109/ECTC.2014.6897570
Estado	Publicada - 11 sept 2014
Publicado de forma externa	Sí
Evento	64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, Estados Unidos Duración: 27 may 2014 → 30 may 2014

Serie de la publicación

Nombre	Proceedings - Electronic Components and Technology Conference
ISSN (versión impresa)	0569-5503

Conferencia

Conferencia	64th Electronic Components and Technology Conference, ECTC 2014
País/Territorio	Estados Unidos
Ciudad	Orlando
Período	27/05/14 → 30/05/14

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10.1109/ECTC.2014.6897570

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Shan, L., Kwark, Y., Rimolo-Donadio, R., Baks, C., Gaynes, M., & Chainer, T. (2014). Preparing 25Gbps electrical I/O for exascale computing systems. En Proceedings - Electronic Components and Technology Conference (pp. 1955-1958). Artículo 6897570 (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897570

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abstract = "This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits as low as 1pJ/bit at 10Gbps for aggregated parallel links. Results from test vehicles confirmed over 20% reduction in channel loss at 20GHz when compared to currently leading commercial materials, which will permit the extension of electrical link performance to meet future system requirements.",

author = "Lei Shan and Young Kwark and Renato Rimolo-Donadio and Christian Baks and Michael Gaynes and Timothy Chainer",

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Shan, L, Kwark, Y, Rimolo-Donadio, R, Baks, C, Gaynes, M & Chainer, T 2014, Preparing 25Gbps electrical I/O for exascale computing systems. En Proceedings - Electronic Components and Technology Conference., 6897570, Proceedings - Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers Inc., pp. 1955-1958, 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, Estados Unidos, 27/05/14. https://doi.org/10.1109/ECTC.2014.6897570

Preparing 25Gbps electrical I/O for exascale computing systems. / Shan, Lei; Kwark, Young; Rimolo-Donadio, Renato et al.
Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 1955-1958 6897570 (Proceedings - Electronic Components and Technology Conference).

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

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N2 - This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits as low as 1pJ/bit at 10Gbps for aggregated parallel links. Results from test vehicles confirmed over 20% reduction in channel loss at 20GHz when compared to currently leading commercial materials, which will permit the extension of electrical link performance to meet future system requirements.

AB - This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits as low as 1pJ/bit at 10Gbps for aggregated parallel links. Results from test vehicles confirmed over 20% reduction in channel loss at 20GHz when compared to currently leading commercial materials, which will permit the extension of electrical link performance to meet future system requirements.

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Shan L, Kwark Y, Rimolo-Donadio R, Baks C, Gaynes M, Chainer T. Preparing 25Gbps electrical I/O for exascale computing systems. En Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc. 2014. p. 1955-1958. 6897570. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2014.6897570

Preparing 25Gbps electrical I/O for exascale computing systems

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