Non-uniform currents on vias and their effects in a parallel-plate environment

Sebastian Müller, Xiaomin Duan, Renato Rimolo-Donadio, Heinz Dietrich Brüns, Christian Schuster

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

13 Citas (Scopus)

Resumen

This paper discusses the generation of non-uniform currents on vias and their impact on the field distribution at the via antipads as well as on the excitation of cavity modes supported by adjacent reference planes. It is shown that the influence of non-uniform currents can be relevant at frequencies above 10 GHz for typical printed circuit board dimensions. The contour integral method is applied to extract the current nonuniformity due to vias in close proximity. An identification of modes is carried out via a discrete Fourier transform. The energy content of the higher modes increases with frequency and via size. It is demonstrated by means of full-wave simulations that non-uniform via currents can lead to anisotropic electromagnetic fields in the antipad region and to the excitation of anisotropic cavity modes.

Idioma originalInglés
Título de la publicación alojada2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
DOI
EstadoPublicada - 2010
Publicado de forma externa
Evento2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010 - Singapore, Singapur
Duración: 7 dic 20109 dic 2010

Serie de la publicación

Nombre2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010

Conferencia

Conferencia2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
País/TerritorioSingapur
CiudadSingapore
Período7/12/109/12/10

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