TY - GEN
T1 - Non-uniform currents on vias and their effects in a parallel-plate environment
AU - Müller, Sebastian
AU - Duan, Xiaomin
AU - Rimolo-Donadio, Renato
AU - Brüns, Heinz Dietrich
AU - Schuster, Christian
PY - 2010
Y1 - 2010
N2 - This paper discusses the generation of non-uniform currents on vias and their impact on the field distribution at the via antipads as well as on the excitation of cavity modes supported by adjacent reference planes. It is shown that the influence of non-uniform currents can be relevant at frequencies above 10 GHz for typical printed circuit board dimensions. The contour integral method is applied to extract the current nonuniformity due to vias in close proximity. An identification of modes is carried out via a discrete Fourier transform. The energy content of the higher modes increases with frequency and via size. It is demonstrated by means of full-wave simulations that non-uniform via currents can lead to anisotropic electromagnetic fields in the antipad region and to the excitation of anisotropic cavity modes.
AB - This paper discusses the generation of non-uniform currents on vias and their impact on the field distribution at the via antipads as well as on the excitation of cavity modes supported by adjacent reference planes. It is shown that the influence of non-uniform currents can be relevant at frequencies above 10 GHz for typical printed circuit board dimensions. The contour integral method is applied to extract the current nonuniformity due to vias in close proximity. An identification of modes is carried out via a discrete Fourier transform. The energy content of the higher modes increases with frequency and via size. It is demonstrated by means of full-wave simulations that non-uniform via currents can lead to anisotropic electromagnetic fields in the antipad region and to the excitation of anisotropic cavity modes.
UR - http://www.scopus.com/inward/record.url?scp=79851506862&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2010.5683028
DO - 10.1109/EDAPS.2010.5683028
M3 - Contribución a la conferencia
AN - SCOPUS:79851506862
SN - 9781424490684
T3 - 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
BT - 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
T2 - 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
Y2 - 7 December 2010 through 9 December 2010
ER -