TY - GEN
T1 - Finite element analysis of MEMS flexible pressure sensor for total ankle replacement
AU - Serrano, Marco V.Bedoya
AU - Vega-Castillo, Paola
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/7/2
Y1 - 2016/7/2
N2 - For several decades, research has been conducted for total ankle replacement to be established as the optimal surgical treatment for diseased or degenerative ankle joints. Few reports exist regarding computer assisted surgery (CAS) and patient specific instrumentation for total ankle replacement (TAR), but no studies regarding instrumented ankle prostheses capable of obtaining stress distribution data or related works using sensing technology for improving patient specific instrumentation exist. In this paper, finite element simulations of a thin film piezo electric sensor for obtaining the pressure map of the contact surface are presented. The pressure map would provide potential benefits for component alignment and enhance TAR final outcomes.
AB - For several decades, research has been conducted for total ankle replacement to be established as the optimal surgical treatment for diseased or degenerative ankle joints. Few reports exist regarding computer assisted surgery (CAS) and patient specific instrumentation for total ankle replacement (TAR), but no studies regarding instrumented ankle prostheses capable of obtaining stress distribution data or related works using sensing technology for improving patient specific instrumentation exist. In this paper, finite element simulations of a thin film piezo electric sensor for obtaining the pressure map of the contact surface are presented. The pressure map would provide potential benefits for component alignment and enhance TAR final outcomes.
KW - ankle replacement
KW - preoperative navigation system
KW - pressure maps
KW - total joint replacement
UR - http://www.scopus.com/inward/record.url?scp=85021428239&partnerID=8YFLogxK
U2 - 10.1109/CONCAPAN.2016.7942351
DO - 10.1109/CONCAPAN.2016.7942351
M3 - Contribución a la conferencia
AN - SCOPUS:85021428239
T3 - 2016 IEEE 36th Central American and Panama Convention, CONCAPAN 2016
BT - 2016 IEEE 36th Central American and Panama Convention, CONCAPAN 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 36th IEEE Central American and Panama Convention, CONCAPAN 2016
Y2 - 9 November 2016 through 11 November 2016
ER -