Fast parametric pre-layout analysis of signal integrity for backplane interconnects

Renato Rimolo-Donadio; Thomas Michael Winkel; Claudio Siviero; Dierk Kaller; Hubert Harrer; Heinz Dietrich Bruns; Christian Schuster

doi:10.1109/SPI.2011.5898839

Fast parametric pre-layout analysis of signal integrity for backplane interconnects

Renato Rimolo-Donadio, Thomas Michael Winkel, Claudio Siviero, Dierk Kaller, Hubert Harrer, Heinz Dietrich Bruns, Christian Schuster

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

2 Citas (Scopus)

Resumen

The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be used to assist this process by allowing a detailed exploration of the design space and the impact of different alternatives in an early stage. This paper addresses this issue by proposing a parametric and automated framework for analysis of single-ended links across multiple substrates with semi-analytical via and trace models. It is shown that this method can provide rapid estimations (second to minute range) and it is suitable for the analysis of configurations with realistic complexity.

Idioma original	Inglés
Título de la publicación alojada	2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings
Páginas	51-54
Número de páginas	4
DOI	https://doi.org/10.1109/SPI.2011.5898839
Estado	Publicada - 2011
Publicado de forma externa	Sí
Evento	2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Naples, Italia Duración: 8 may 2011 → 11 may 2011

Serie de la publicación

Nombre	2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings

Conferencia

Conferencia	2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011
País/Territorio	Italia
Ciudad	Naples
Período	8/05/11 → 11/05/11

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10.1109/SPI.2011.5898839

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Rimolo-Donadio, R., Winkel, T. M., Siviero, C., Kaller, D., Harrer, H., Bruns, H. D., & Schuster, C. (2011). Fast parametric pre-layout analysis of signal integrity for backplane interconnects. En 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings (pp. 51-54). Artículo 5898839 (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings). https://doi.org/10.1109/SPI.2011.5898839

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abstract = "The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be used to assist this process by allowing a detailed exploration of the design space and the impact of different alternatives in an early stage. This paper addresses this issue by proposing a parametric and automated framework for analysis of single-ended links across multiple substrates with semi-analytical via and trace models. It is shown that this method can provide rapid estimations (second to minute range) and it is suitable for the analysis of configurations with realistic complexity.",

author = "Renato Rimolo-Donadio and Winkel, {Thomas Michael} and Claudio Siviero and Dierk Kaller and Hubert Harrer and Bruns, {Heinz Dietrich} and Christian Schuster",

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Rimolo-Donadio, R, Winkel, TM, Siviero, C, Kaller, D, Harrer, H, Bruns, HD & Schuster, C 2011, Fast parametric pre-layout analysis of signal integrity for backplane interconnects. En 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings., 5898839, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings, pp. 51-54, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011, Naples, Italia, 8/05/11. https://doi.org/10.1109/SPI.2011.5898839

Fast parametric pre-layout analysis of signal integrity for backplane interconnects. / Rimolo-Donadio, Renato; Winkel, Thomas Michael; Siviero, Claudio et al.
2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings. 2011. p. 51-54 5898839 (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings).

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

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AU - Rimolo-Donadio, Renato

AU - Winkel, Thomas Michael

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AU - Bruns, Heinz Dietrich

AU - Schuster, Christian

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AB - The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be used to assist this process by allowing a detailed exploration of the design space and the impact of different alternatives in an early stage. This paper addresses this issue by proposing a parametric and automated framework for analysis of single-ended links across multiple substrates with semi-analytical via and trace models. It is shown that this method can provide rapid estimations (second to minute range) and it is suitable for the analysis of configurations with realistic complexity.

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Rimolo-Donadio R, Winkel TM, Siviero C, Kaller D, Harrer H, Bruns HD et al. Fast parametric pre-layout analysis of signal integrity for backplane interconnects. En 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings. 2011. p. 51-54. 5898839. (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings). doi: 10.1109/SPI.2011.5898839

Fast parametric pre-layout analysis of signal integrity for backplane interconnects

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