TY - JOUR
T1 - Extraction of via-plate capacitance of an eccentric via by an integral approximation method
AU - Zhang, Yaojiang
AU - Rimolo-Donadio, Renato
AU - Fan, Jun
AU - Schuster, Christian
AU - Li, Erping
PY - 2009/5
Y1 - 2009/5
N2 - An integral approximation method is proposed to extract the via-plate capacitance of an eccentric via in the via hole (anti-pad). An analytical formula is derived for the coaxial capacitance part, which is used as a benchmark to validate the integral approximation method. Furthermore, numerical simulations are also used to validate the method. It is shown that small eccentricity results in only a few percentage increase of the via-plate capacitance, which is helpful in specifying the manufacturing tolerance of via designs.
AB - An integral approximation method is proposed to extract the via-plate capacitance of an eccentric via in the via hole (anti-pad). An analytical formula is derived for the coaxial capacitance part, which is used as a benchmark to validate the integral approximation method. Furthermore, numerical simulations are also used to validate the method. It is shown that small eccentricity results in only a few percentage increase of the via-plate capacitance, which is helpful in specifying the manufacturing tolerance of via designs.
KW - Eccentric vias
KW - Printed circuit board (PCB)
KW - Signal integrity (SI)
KW - Via-plate capacitance
UR - http://www.scopus.com/inward/record.url?scp=67649233104&partnerID=8YFLogxK
U2 - 10.1109/LMWC.2009.2017587
DO - 10.1109/LMWC.2009.2017587
M3 - Artículo
AN - SCOPUS:67649233104
SN - 1531-1309
VL - 19
SP - 275
EP - 277
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
IS - 5
M1 - 4840543
ER -