TY - GEN
T1 - Evaluation of a Segmented Approach to Model PCB-Based Links of a PCIe Bus
AU - Aparicio-Morales, Javier
AU - Gamboa-González, Gabriel
AU - Moraga-Mora, Rolando
AU - Rojas-Fernández, Juan Carlos
AU - Rimolo-Donadio, Renato
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/7/2
Y1 - 2018/7/2
N2 - In this work, a segmented approach to model PCI Express buses on PCBs, in terms of S-parameters, is analyzed. The models are built with a 3D full-wave approach. The goal is to evaluate a traditional segmented approach considering only signal paths, against complete full-wave models with mixed reference planes. It will be shown that, for the studied topology, transmission can be estimated through the segmented approach with good accuracy below 20 GHz. However, differences are observed at higher frequencies. For the case of mixed reference planes, the segmented approach underestimates crosstalk levels.
AB - In this work, a segmented approach to model PCI Express buses on PCBs, in terms of S-parameters, is analyzed. The models are built with a 3D full-wave approach. The goal is to evaluate a traditional segmented approach considering only signal paths, against complete full-wave models with mixed reference planes. It will be shown that, for the studied topology, transmission can be estimated through the segmented approach with good accuracy below 20 GHz. However, differences are observed at higher frequencies. For the case of mixed reference planes, the segmented approach underestimates crosstalk levels.
KW - Interconnects
KW - Mixed-Reference Planes
KW - PCI Express
KW - S-parameter Models
KW - Signal Integrity
UR - http://www.scopus.com/inward/record.url?scp=85065674169&partnerID=8YFLogxK
U2 - 10.1109/LAMC.2018.8699051
DO - 10.1109/LAMC.2018.8699051
M3 - Contribución a la conferencia
AN - SCOPUS:85065674169
T3 - 2018 IEEE MTT-S Latin America Microwave Conference, LAMC 2018 - Proceedings
BT - 2018 IEEE MTT-S Latin America Microwave Conference, LAMC 2018 - Proceedings
A2 - Fernandez-Del-Carpio, Gonzalo M.
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2nd IEEE MTT-S Latin America Microwave Conference, LAMC 2018
Y2 - 12 December 2018 through 14 December 2018
ER -