@inproceedings{9a3d762d73164ae8a26100689a0016b9,
title = "Electrical interconnect design for testing of high-speed IC transceivers",
abstract = "This paper discusses the requirements and challenges associated with the design of electrical interconnects to support the test and evaluation of high-speed transceivers working up to 40 Gb/s. It will be shown that relatively low cost technologies such as FR-4 boards, push-on connectors, and wire bonding can effectively achieve this goal. A specific platform and its application for testing of a 40-Gb/s VCSEL-based optoelectronic link are presented.",
keywords = "interconnects, power integrity, printed circuit board, short-reach link, signal integrity, wire bond",
author = "R. Rimolo-Donadio and C. Baks and Lee, {B. G.} and Song, {J. H.} and X. Gu and Kwark, {Y. H.} and Kuchta, {D. M.} and Rylyakov, {A. V.} and Schow, {C. L.}",
year = "2012",
doi = "10.1109/EPEPS.2012.6457842",
language = "Ingl{\'e}s",
isbn = "9781467325394",
series = "2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012",
pages = "55--58",
booktitle = "2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012",
note = "2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 ; Conference date: 21-10-2012 Through 24-10-2012",
}