TY - GEN
T1 - Bandwidth study of recessed probe launch variations for broadband measurement of embedded PCB structures
AU - Kotzev, Miroslav
AU - Rimolo-Donadio, Renato
AU - Schuster, Christian
AU - Gu, Xiaoxiong
AU - Kwark, Young H.
AU - Ritter, Mark B.
PY - 2009
Y1 - 2009
N2 - In this paper the recessed probe launch technique for measurement of embedded (internal) printed circuit board (PCB) structures such as striplines and vias (plated through holes) will be reviewed and its bandwidth will be studied in experiments. The recessed probe launch (RPL) uses high frequency microprobes in combination with a milling technique that removes upper board layers and exposes internal probing points. By providing direct access to the PCB layers of interest a broadband launch into embedded structures is thus provided. Here, measurements of different RPL designs show that reflections of less than -25 dB from DC up to 40 GHz can be achieved. First investigations show that this level of reflection is mostly due to a mismatched stripline impedance in the 52 Ohm range and not due to the recessed probe launch itself. Full-wave simulations are underway to corroborate the results obtained by measurements.
AB - In this paper the recessed probe launch technique for measurement of embedded (internal) printed circuit board (PCB) structures such as striplines and vias (plated through holes) will be reviewed and its bandwidth will be studied in experiments. The recessed probe launch (RPL) uses high frequency microprobes in combination with a milling technique that removes upper board layers and exposes internal probing points. By providing direct access to the PCB layers of interest a broadband launch into embedded structures is thus provided. Here, measurements of different RPL designs show that reflections of less than -25 dB from DC up to 40 GHz can be achieved. First investigations show that this level of reflection is mostly due to a mismatched stripline impedance in the 52 Ohm range and not due to the recessed probe launch itself. Full-wave simulations are underway to corroborate the results obtained by measurements.
UR - http://www.scopus.com/inward/record.url?scp=67650118730&partnerID=8YFLogxK
U2 - 10.1109/GEMIC.2009.4815847
DO - 10.1109/GEMIC.2009.4815847
M3 - Contribución a la conferencia
AN - SCOPUS:67650118730
SN - 9783981266801
T3 - German Microwave Conference, GeMIC 2009
BT - German Microwave Conference, GeMIC 2009
T2 - German Microwave Conference, GeMIC 2009
Y2 - 16 March 2009 through 18 March 2009
ER -