Via Transition Optimization Using a Domain Decomposition Approach

Allan Carmona-Cruz, Katharina Scharff, Jonathan Cedeño-Chaves, Heinz Dietrich Brüns, Renato Rimolo-Donadio, Christian Schuster

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

10 Scopus citations

Abstract

A method to minimize the return loss for via interconnects on printed circuit boards (PCB), based on the domain decomposition of traces, via barrels, and trace-to-via transitions is presented. This decomposition allows to optimize different via lengths, by separating the via barrel as an independent domain. The method is demonstrated by full-wave simulations. It starts by optimizing the via impedance, matching the traces by an appropriate size of the via environment followed by a subsequent compensation of trace-to-via transition discontinuities. Equivalent circuits of each domain are used to corroborate the performance improvement. Three pad geometries are proposed to compensate the discontinuities of a trace-to-via transition. For a long via on a PCB with eleven metal layers, using four ground vias, it was possible to achieve a wide-band low-reflection response below -30 dB from DC up to 32 GHz for microstrip traces and -37 dB from DC up to 20 GHz for stripline traces.

Original languageEnglish
Title of host publication2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538683422
DOIs
StatePublished - Jun 2019
Event23rd IEEE Workshop on Signal and Power Integrity, SPI 2019 - Chambery, France
Duration: 18 Jun 201921 Jun 2019

Publication series

Name2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings

Conference

Conference23rd IEEE Workshop on Signal and Power Integrity, SPI 2019
Country/TerritoryFrance
CityChambery
Period18/06/1921/06/19

Keywords

  • Compensation
  • domain decomposition
  • printed circuit board
  • signal integrity
  • trace-to-via transition
  • vertical interconnect
  • via impedance

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