Abstract
Two different approaches to calculate analytically the impedance of rectangular power planes of printed circuit boards and package structures (parallel-plate impedance) are discussed, namely, the cavity resonator model and the radial waveguide approach. Both methods are compared and it is shown that they can be combined to improve the efficiency of the computation over a broad frequency range.
Original language | English |
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Pages (from-to) | 2051-2056 |
Number of pages | 6 |
Journal | Microwave and Optical Technology Letters |
Volume | 51 |
Issue number | 9 |
DOIs | |
State | Published - Sep 2009 |
Externally published | Yes |
Keywords
- Cavity model
- Parallel-plate impedance
- Power distribution network
- Radial waveguide