High frequency measurement techniques for vias in printed circuit boards

Miroslav Kotzev, Young H. Kwark, Sebastian Müller, Andreas Hardock, Renato Rimolo-Donadio, Christian Baks, Christian Schuster

Research output: Contribution to specialist publicationArticle

3 Scopus citations

Abstract

This article provides an overview of some multiport measurement techniques for dense via arrays, which play an important role in high-speed links as package and connector footprints in multilayer printed circuit boards. Advantages, challenges, and limitations of three approaches for high-frequency measurements up to 50 GHz are discussed: launches with fan-out traces and on-board coaxial connectors, double-sided direct surface probing with RF microprobes, and recessed probe launches with extension traces and microprobes. The measurement results obtained by the presented measurement techniques are then compared to simulation results computed using full-wave and physics-based via models. Finally, the multiport probing approach with interposers is addressed through a case study of simultaneous access for up to 12 vias in a 1 mm pitch via array that can be applied for measurements in the frequency range up to 10-15 GHz.

Original languageEnglish
Pages104-113
Number of pages10
Volume3
No4
Specialist publicationIEEE Electromagnetic Compatibility Magazine
DOIs
StatePublished - 1 Oct 2014

Keywords

  • parallel plates
  • printed circuit board
  • RF microprobes
  • signal and power integrity
  • two-tier calibration
  • vector network analyzer
  • vias

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