Abstract
This paper presents a method for fast and comprehensive simulation of signal propagation, power/ground noise, and radiated emissions by combining the merits of the physics-based via model, the modal decomposition technique, the contour integral method (CIM), and the equivalence principle. The physics-based via model combined with the modal decomposition technique is an efficient technique for signal integrity analysis of multilayer PCBs and packages. The CIM can be used to calculate the voltage distribution between arbitrarily shaped power planes. Far-field radiation can be obtained by applying the field equivalence principle. In this paper, we integrate the four techniques to analyze all the three effects in a fast, concurrent, and holistic manner. To the best knowledge of the authors, the four techniques are integrated here for the first time. Various structures are simulated and validated with full-wave simulations up to 20 GHz. It is shown that a reduction in simulation time of more than two orders of magnitude is achieved in comparison to a standard full-wave electromagnetic solver.
Original language | English |
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Article number | 5422640 |
Pages (from-to) | 487-495 |
Number of pages | 9 |
Journal | IEEE Transactions on Electromagnetic Compatibility |
Volume | 52 |
Issue number | 2 |
DOIs | |
State | Published - May 2010 |
Externally published | Yes |
Keywords
- Contour integral method (CIM)
- Field equivalence principle
- Physics-based via and trace model
- Power integrity (PI)
- Printed circuit board (PCB)
- Signal integrity (SI)